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Examines more than 100 cases of failure and the process by which they were analyzed, diagnosed, and resolved. The book provides expert analysis and insight on a variety of materials, failure modes, root causes, and analytical techniques. It includes sections dedicated to specific components and industries.
The theme for the November 2017 conference is Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Key articles from over 10 separate ASM publications are brought together as a reference on weld integrity crack prevention. This book covers the essentials of weld solidification and cracking, weldability and material selection, process control and heat treatment, failure analysis, and fatigue and fracture mechanics weldments.
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