Bøger af Erdogan Madenci

This book presents recent improvements in peridynamic modeling of structures. It provides sufficient theory and numerical implementation helpful to both new and existing researchers in the field.  The main focus of the book is on the non-ordinary state-based (NOSB) peridynamics (PD) and its applications for performing finite deformation. It presents the framework for modeling high stretch polymers, viscoelastic materials, thermoelasticity, plasticity, and creep. It provides a systematic derivation for dimensionally reduced structures such as axisymmetric structures and beams. Also, it presents a novel approach to impose boundary conditions without suffering from displacement kinks near the boundary. Furthermore, it presents refinements to bond-based PD model by including rotation kinematics for modeling isotropic and composite materials. Moreover, it presents a PD - FEM coupling framework in ANSYS based on principle for virtual work. Lastly, it presents an application of neural networks in the peridynamic (PINN) framework. Sample codes are provided for readers to develop hands-on experience on peridynamic modeling.  Describes new developments in peridynamics and their applications in the presence of material and geometric nonlinearity; Describes an approach to seamlessly couple PD with FE; Introduces the use of the neural network in the PD framework to solve engineering problems;Provides theory and numerical examples for researchers and students to self-study and apply in their research (Codes are provided as supplementary material);Provides theoretical development and numerical examples suitable for graduate courses.

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

The Finite Element Method and Applications in Engineering Using ANSYS(R)

This book presents the peridynamic theory, which provides the capability for improved modeling of progressive failure in materials and structures, and paves the way for addressing multi-physics and multi-scale problems.

PD also serves as a natural filter to smooth noisy data and to recover missing data. This book starts with an overview of the PD concept, the derivation of the PD differential operator, its numerical implementation for the spatial and temporal derivatives, and the description of sources of error.