Bøger af G. Mani Sankar

The transition from 4G to 5G marks a significant leap in wireless communication technology. 4G, represented by Long-Term Evolution (LTE), brought about faster data speeds and enabled high-definition multimedia streaming and online gaming. Leveraging techniques like Orthogonal Frequency Division Multiplexing (OFDM) and Multiple Input Multiple Output (MIMO) antennas, 4G networks significantly improved data transmission efficiency and coverage. In contrast, 5G networks promise to revolutionize connectivity with even faster data rates, ultra-low latency, and massive device connectivity. 5G achieves these advancements through the utilization of higher-frequency radio waves, such as millimeter waves, and advanced antenna technologies like Massive MIMO. This next-generation technology facilitates groundbreaking applications like autonomous vehicles, augmented reality, and the Internet of Things (IoT), all while aiming to reduce latency to near real-time levels. However, the deployment of 5G networks presents challenges, including significant infrastructure investment, addressing privacy and security concerns, and ensuring compatibility with existing systems.

The aim of low power VLSI design is to minimize the individual components of power as much as possible, hence decreasing the total power consumption. Power is considered as the most important one in embedded system. Low power is essential in 1. High execution frameworks in light of the fact that unreasonable power scattering deludes the dependability and expanded the expense forced by cooling frameworks 2. Portable systems.The rising conspicuousness of convenient frameworks and the need to restrict power utilization (and thus, heat scattering) in exceptionally high thickness ULSI chips have prompted quick and imaginative improvements in low-power plan during the new years. The main impetuses behind these improvements are versatile applications requiring low power dissemination and high throughput, like journal PCs, compact specialized gadgets and individual computerized collaborators (PDAs). In the vast majority of these cases, the necessities of low power utilization should be met alongside similarly requesting objectives of high chip thickness and high throughput.