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This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thi
This introductory text is intended to provide undergraduate engineering students with the background needed to understand the science of structure-property relationships, as well as address the engineering concerns of materials selection in design.
Suitable as a reference work for reliability professionals or as a text for graduate students, this book introduces reliability literature of microelectronic and electronic-optional devices. It integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation.
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