Udvidet returret til d. 31. januar 2025

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Bag om Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781441995414
  • Indbinding:
  • Hardback
  • Sideantal:
  • 560
  • Udgivet:
  • 25. november 2012
  • Udgave:
  • 2012
  • Størrelse:
  • 161x241x37 mm.
  • Vægt:
  • 1010 g.
  • BLACK WEEK
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Leveringstid: 8-11 hverdage
Forventet levering: 10. december 2024
Forlænget returret til d. 31. januar 2025

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This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits.

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