Gør som tusindvis af andre bogelskere
Tilmeld dig nyhedsbrevet og få gode tilbud og inspiration til din næste læsning.
Ved tilmelding accepterer du vores persondatapolitik.Du kan altid afmelde dig igen.
Focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of System-in-Package (SiP). The book first introduces package technologies, and then presents SiP design flow and design exploration. Finally, it discusses details of beyond-die signal and power integrity and physical implementation.
As the first book to introduce and analyze cultural studies in contemporary China, this volume is an important resource for Western scholars wishing to understand the rise and development of cultural studies in China.
Tilmeld dig nyhedsbrevet og få gode tilbud og inspiration til din næste læsning.
Ved tilmelding accepterer du vores persondatapolitik.