Bøger af Michael Pecht

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?Chapters discuss:failure sites, operational loads, and failure mechanismintrinsic device sensitivitieselectromigrationhot carrier agingtime dependent dielectric breakdownmechanical stress induced migrationalpha particle sensitivityelectrostatic discharge (ESD) and electrical overstresslatch-upqualificationscreeningguidelines for designing reliabilityGuidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

Documents the technologies, manufacturing procedures, capabilities, and infrastructure that have made the Republic of Korea successful in the electronics industry. This book covers the major segments of Korea's electronics industry, including semiconductors, packaging, displays, printed circuit boards, and systems.

Documents the technologies, manufacturing procedures, capabilities, and infrastructure that have made the Republic of Korea successful in the electronics industry. This book covers the major segments of Korea's electronics industry, including semiconductors, packaging, displays, printed circuit boards, and systems.

Explores the fundamental theory and advanced technologies for improving routing. This book includes descriptions of timing delay, clock skew, and noise control requirements in signal integrity along with computer-aided approaches to managing these requirements in high-speed PCB/MCM routing.

Examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This book provides a framework for how to model the mechanism, test for defects, and avoid and manage damage.

Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals.