Udvidet returret til d. 31. januar 2025

Hybrid Assemblies and Multichip Modules

Bag om Hybrid Assemblies and Multichip Modules

Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.

Vis mere
  • Sprog:
  • Engelsk
  • ISBN:
  • 9780824784669
  • Indbinding:
  • Hardback
  • Sideantal:
  • 296
  • Udgivet:
  • 16. december 1992
  • Størrelse:
  • 156x234x17 mm.
  • Vægt:
  • 635 g.
  • BLACK WEEK
  Gratis fragt
Leveringstid: 8-11 hverdage
Forventet levering: 9. december 2024

Beskrivelse af Hybrid Assemblies and Multichip Modules

Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.

Brugerbedømmelser af Hybrid Assemblies and Multichip Modules



Find lignende bøger
Bogen Hybrid Assemblies and Multichip Modules findes i følgende kategorier:

Gør som tusindvis af andre bogelskere

Tilmeld dig nyhedsbrevet og få gode tilbud og inspiration til din næste læsning.