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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

- Ceramic research and development in Japan

Bag om Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781851665792
  • Indbinding:
  • Hardback
  • Sideantal:
  • 242
  • Udgivet:
  • 30. april 1993
  • Størrelse:
  • 254x178x16 mm.
  • Vægt:
  • 1200 g.
  Gratis fragt
Leveringstid: 8-11 hverdage
Forventet levering: 16. december 2024
Forlænget returret til d. 31. januar 2025

Beskrivelse af Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.

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