Rapid Analysis of Nonferrous Metals and Alloys

CONTENTS -

1. SPECIAL REAGENTS -

2. INGOT COPPER -
Copper; Lead and Iron; Bismuth; Antimony
and Arsenic; Sulfur -

3. BRASSES AND BRONZES -
Sequence Procedure for Copper, Lead, Tin,
Nickel, and Iron in Brasses and Bronzes with
Less than 0.3% Iron and No Manganese;
Zinc; Phosphorus; Antimony; Sulfur; Sequence
Procedure for Copper, Lead, Tin,
Manganese, Nickel, Iron, and Aluminum in
Manganese Bronzes; Zinc; Sequence Procedure
for Copper, Lead, Tin, Manganese,
Iron, and Aluminum in Copper-Nickel Alloys;
Nickel; Zinc; Sequence Procedure for
Copper, Lead, Iron, Nickel, and Manganese
in Silicon Bronzes; Silicon and Tin; Aluminum;
Phosphorus; Zinc; Sequence Procedure
for Copper, Lead, Tin, Manganese,
Nickel, and Iron in Copper-Beryllium Alloys;
Cobalt; Silicon and Beryllium; Sequence
Procedure for Copper, Lead, Iron, Nickel,
Manganese, and Zinc in Copper-Arsenic
Alloys; Aluminum; Silicon and Tin; Phosphorus;
Arsenic -

4. MONEL METAL AND NICKEL METAL -
Sequence Procedure for Silicon, Copper,
Manganese, Iron, Aluminum, and Cobalt;
Sulfur; Chromium; Titanium -

5. ALUMINUM ALLOYS -
Sequence Procedure for Copper, Lead, Manganese,
Iron, and Nickel; Copper in Separate
Sample; Iron in Separate Sample; Zinc;
Silicon; Magnesium; Titanium; Chromium;
Tin; Copper, Lead, and Bismuth -

6. MAGNESIUM ALLOYS -
Aluminum by the Succinate Method; Aluminum
Colorimetrically; Zinc (over 1.5%)
Electrolytically; Zinc (Less than 1.5%) by
H28-ZnO Method; Sequence Procedure for
Copper, Iron, and Nickel; Silicon; Manganese; Tin -

7. ZINC METAL (SPELTER) -
Sequence Procedure for Tin, Copper, Lead,
Iron, and Aluminum; Cadmium -

8. ZINC-BASE DIE-CASTING ALLOYS -
Sequence Procedure for Tin, Copper, Lead,
and Iron; Cadmium; Aluminum Colorimetrically;
Aluminum and Magnesium by
Mercury-Cathode Method -

9. CADMIUM METAL -
Cadmium; Sequence Procedure for Tin, Lead,
Iron, and Aluminum; Sequence Procedure
for Silver, Copper, and Bismuth; Arsenic
and Antimony; Zinc -

10. TIN METAL -
Sequence Procedure for Bismuth, Copper,
Lead, Iron and Zinc; Antimony; Arsenic -

11. LEAD METAL -
Sequence Procedure for Tin, Silver, Iron,
Bismuth and Copper; Antimony and Arsenic;
Zinc -

12. LEAD-BASE BEARING METAL -
Lead; Tin; Antimony; Arsenic; Copper;
Bismuth; Iron -

13. TIN-BASE BEARING METAL -
Tin; Antimony; Arsenic; Lead; Copper;
Bismuth; Iron -

14. LEAD-TIN SOLDERS -
Determination of Flux (Rosin Core); Determination
of Flux (Zinc Chloride Core);
Lead; Tin; Antimony; Arsenic; Copper;
Bismuth; Iron -

15. SILVER SOLDERS -
Sequence Procedure for Silver, Copper, Cadmium
and Zinc; Sequence Procedure for Tin,
Lead, Iron, and Nickel -

16. FUSIBLE BISMUTH ALLOYS -
Sequence Procedure for Bismuth, Lead, and Cadmium -

Index -