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Sic Power Module Design: Performance, Robustness and Reliability

Bag om Sic Power Module Design: Performance, Robustness and Reliability

Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781785619076
  • Indbinding:
  • Hardback
  • Sideantal:
  • 360
  • Udgivet:
  • 3. februar 2022
  • Størrelse:
  • 160x25x239 mm.
  • Vægt:
  • 662 g.
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Leveringstid: 8-11 hverdage
Forventet levering: 16. december 2024
Forlænget returret til d. 31. januar 2025

Beskrivelse af Sic Power Module Design: Performance, Robustness and Reliability

Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.

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