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Direct Copper Interconnection for Advanced Semiconductor Technology

Bag om Direct Copper Interconnection for Advanced Semiconductor Technology

In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781032528236
  • Indbinding:
  • Hardback
  • Sideantal:
  • 448
  • Udgivet:
  • 28. juni 2024
  • Størrelse:
  • 243x163x33 mm.
  • Vægt:
  • 836 g.
  • BLACK NOVEMBER
  Gratis fragt
Leveringstid: 8-11 hverdage
Forventet levering: 7. december 2024

Beskrivelse af Direct Copper Interconnection for Advanced Semiconductor Technology

In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.

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